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399 X 95997 B-XH
Forever
The specific heat capacity of 399 X 95997 B-XH Generally refers to the heat required when the temperature of plastic molded products rises by 1°C. Specific heat capacity is the same as thermal conductivity and is the reference data for studying the temperature rise of target products in product design.
The continuous operating temperature of 399 X 95997 B-XH reflects the heat resistance of plastic molded products. Generally divided into physical heat resistance and chemical heat resistance. The former refers to the performance of maintaining the shape of the product at a specified heating temperature; the latter represents the thermal stability of molecular bonds in plastic molding materials.
General | ||
Form | ||
Filler | Thermally Conductive
| |
Feature | ||
Physical Nominal Value Test Method | ||
Density / Specific Gravity 1.41 g/cm³ ASTM D792 | ||
Linear Mold Shrinkage(Thickness; 3.17 mm) 0.1 % ASTM D955 | ||
Mechanical Nominal Value Test Method | ||
Tensile Strength, Break 82.7 MPa ASTM D638 | ||
Elongation at Break 1.0 % ASTM D638 | ||
Tensile Modulus 1.59E+4 MPa ASTM D638 | ||
Flexural Strength 131 MPa ASTM D790 | ||
Flexural Modulus 1.45E+4 MPa ASTM D790 | ||
Izod Impact, Notched(Thickness; 3.17 mm) 64.1 J/m ASTM D256 | ||
Izod Impact, Unnotched(Thickness; 3.17 mm;80x10x3 mm) | 240 J/m ASTM D4812 | |
Thermal Nominal Value Test Method | ||
Thermal conductivity through plane(through-plane) 1.30 W/m-K ASTM E1530 | ||
Deflection Temperature(Pressure; 1.8 MPa) 143 °C ASTM D648 | ||
Electrical Nominal Value Test Method | ||
Volume Resistivity < = 1000 ohms ·cm ASTM D257 | ||
Surface Resistivity per Square < = 1e+05 ASTM D257 | ||
Processing Nominal Value | ||
Melt Temperature 288 - 316 °C | ||
Mold Temperature 82.2 - 121 °C | ||
Drying Temperature 121 °C | ||
Dry Time 4 hour | ||
Moisture Content 0.020 % | ||
Dew Point -28.9 °C | ||
Injection Pressure 68.9 - 103 MPa | ||
Product Description: High Thermal Conductivity Electrically Insulating Polycarbonate (PC) Granule Resin
Our High Thermal Conductivity Electrically Insulating Polycarbonate (PC) Granule Resin is a cutting-edge material designed to meet the demanding requirements of various industries. With its exceptional properties and benefits, our PC granules resin offers an excellent solution for applications that require both thermal conductivity and electrical insulation.
Features:
1. High Thermal Conductivity: Our PC granules resin exhibits excellent thermal conductivity, allowing for efficient heat dissipation. It helps to prevent heat buildup and ensures optimal performance even in demanding thermal environments.
2. Electrically Insulating Properties: The electrically insulating nature of our PC granules resin provides effective electrical insulation, protecting sensitive components and circuits from electrical conductivity issues. It ensures reliable and safe operation in electrical applications.
3. Superior Material Strength: Our PC granules resin offers excellent mechanical strength, making it highly resistant to impact, abrasion, and deformation. It provides durability and long-term reliability in various challenging conditions.
Benefits:
1. Enhanced Heat Management: The high thermal conductivity of our PC granules resin facilitates effective heat management, reducing the risk of overheating and extending the lifespan of components. It helps improve overall system performance and reliability.
2. Electrical Safety: The electrically insulating properties of our PC granules resin ensure electrical safety by preventing short circuits and electrical leakage. It is an ideal choice for applications where electrical insulation is critical.
3. Design Flexibility: With its excellent molding properties, our PC granules resin allows for intricate and precise molding of complex shapes. It offers design flexibility, enabling the creation of customized components for specific requirements.
4. Cost Efficiency: By providing both thermal conductivity and electrical insulation in a single material, our PC granules resin eliminates the need for additional components or layers. This results in cost savings during manufacturing and assembly processes.
5. Wide Range of Applications: Our PC granules resin finds applications in various industries, including electronics, automotive, aerospace, and more. It is suitable for heat sinks, LED lighting, power modules, electrical enclosures, and other thermal management and electrical insulation applications.
Choose our High Thermal Conductivity Electrically Insulating Polycarbonate (PC) Granule Resin to benefit from its outstanding features, superior performance, and versatile applications. Experience enhanced heat management, electrical safety, and design flexibility with this advanced resin solution.
The specific heat capacity of 399 X 95997 B-XH Generally refers to the heat required when the temperature of plastic molded products rises by 1°C. Specific heat capacity is the same as thermal conductivity and is the reference data for studying the temperature rise of target products in product design.
The continuous operating temperature of 399 X 95997 B-XH reflects the heat resistance of plastic molded products. Generally divided into physical heat resistance and chemical heat resistance. The former refers to the performance of maintaining the shape of the product at a specified heating temperature; the latter represents the thermal stability of molecular bonds in plastic molding materials.
General | ||
Form | ||
Filler | Thermally Conductive
| |
Feature | ||
Physical Nominal Value Test Method | ||
Density / Specific Gravity 1.41 g/cm³ ASTM D792 | ||
Linear Mold Shrinkage(Thickness; 3.17 mm) 0.1 % ASTM D955 | ||
Mechanical Nominal Value Test Method | ||
Tensile Strength, Break 82.7 MPa ASTM D638 | ||
Elongation at Break 1.0 % ASTM D638 | ||
Tensile Modulus 1.59E+4 MPa ASTM D638 | ||
Flexural Strength 131 MPa ASTM D790 | ||
Flexural Modulus 1.45E+4 MPa ASTM D790 | ||
Izod Impact, Notched(Thickness; 3.17 mm) 64.1 J/m ASTM D256 | ||
Izod Impact, Unnotched(Thickness; 3.17 mm;80x10x3 mm) | 240 J/m ASTM D4812 | |
Thermal Nominal Value Test Method | ||
Thermal conductivity through plane(through-plane) 1.30 W/m-K ASTM E1530 | ||
Deflection Temperature(Pressure; 1.8 MPa) 143 °C ASTM D648 | ||
Electrical Nominal Value Test Method | ||
Volume Resistivity < = 1000 ohms ·cm ASTM D257 | ||
Surface Resistivity per Square < = 1e+05 ASTM D257 | ||
Processing Nominal Value | ||
Melt Temperature 288 - 316 °C | ||
Mold Temperature 82.2 - 121 °C | ||
Drying Temperature 121 °C | ||
Dry Time 4 hour | ||
Moisture Content 0.020 % | ||
Dew Point -28.9 °C | ||
Injection Pressure 68.9 - 103 MPa | ||
Product Description: High Thermal Conductivity Electrically Insulating Polycarbonate (PC) Granule Resin
Our High Thermal Conductivity Electrically Insulating Polycarbonate (PC) Granule Resin is a cutting-edge material designed to meet the demanding requirements of various industries. With its exceptional properties and benefits, our PC granules resin offers an excellent solution for applications that require both thermal conductivity and electrical insulation.
Features:
1. High Thermal Conductivity: Our PC granules resin exhibits excellent thermal conductivity, allowing for efficient heat dissipation. It helps to prevent heat buildup and ensures optimal performance even in demanding thermal environments.
2. Electrically Insulating Properties: The electrically insulating nature of our PC granules resin provides effective electrical insulation, protecting sensitive components and circuits from electrical conductivity issues. It ensures reliable and safe operation in electrical applications.
3. Superior Material Strength: Our PC granules resin offers excellent mechanical strength, making it highly resistant to impact, abrasion, and deformation. It provides durability and long-term reliability in various challenging conditions.
Benefits:
1. Enhanced Heat Management: The high thermal conductivity of our PC granules resin facilitates effective heat management, reducing the risk of overheating and extending the lifespan of components. It helps improve overall system performance and reliability.
2. Electrical Safety: The electrically insulating properties of our PC granules resin ensure electrical safety by preventing short circuits and electrical leakage. It is an ideal choice for applications where electrical insulation is critical.
3. Design Flexibility: With its excellent molding properties, our PC granules resin allows for intricate and precise molding of complex shapes. It offers design flexibility, enabling the creation of customized components for specific requirements.
4. Cost Efficiency: By providing both thermal conductivity and electrical insulation in a single material, our PC granules resin eliminates the need for additional components or layers. This results in cost savings during manufacturing and assembly processes.
5. Wide Range of Applications: Our PC granules resin finds applications in various industries, including electronics, automotive, aerospace, and more. It is suitable for heat sinks, LED lighting, power modules, electrical enclosures, and other thermal management and electrical insulation applications.
Choose our High Thermal Conductivity Electrically Insulating Polycarbonate (PC) Granule Resin to benefit from its outstanding features, superior performance, and versatile applications. Experience enhanced heat management, electrical safety, and design flexibility with this advanced resin solution.
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