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Black Color Improved Plating Surface PC Compound for LDS
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Black Color Improved Plating Surface PC Compound for LDS

Dongguan Forever Co.,Ltd is the producer of Black color improved Plating Surface PC compound for LDS
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  • DX11355-XH

  • FOREVER


Introducing our latest product, the LNP THERMOCOMP DX11355-XH compound. This cutting-edge compound is crafted using a Polycarbonate (PC) resin, infused with our exclusive proprietary fillers, resulting in exceptional quality and performance. Made exclusively in a sleek black color, this compound is not only visually striking, but also offers a range of outstanding features.


One notable advantage of the LNP THERMOCOMP DX11355-XH compound is its highly improved plating surface and mechanical performance. This makes it particularly suitable for Laser Direct Structuring (LDS) applications, where precision and reliability are paramount. Expect exceptional results when using this compound for your LDS projects.


Furthermore, this advanced compound boasts improved impact resistance, making it highly durable and reliable in various settings. It is specially engineered to provide the necessary protection and longevity required for demanding applications.


In addition, our LNP THERMOCOMP DX11355-XH compound is designed to be environmentally friendly, as it is formulated without the inclusion of brominated or chlorinated flame retardants. This ensures a safer and more sustainable option for your manufacturing needs.


Overall, the LNP THERMOCOMP DX11355-XH compound offers a superior combination of strength, durability, and functionality. Its unique formulation, combined with its exceptional features, guarantees top-notch performance in a wide range of applications. Experience the difference of this exceptional product today.


General

Form



Feature


Non-Brominated & Non-

Chlorinated Flame          

Retardant

Non-Chlorinated Colorable

Lds

 Enhanced Ductility

 Circuit Solution

 Automotive                      Consumer                        Laser Direct Structuring

Electrical

Physical

Nominal Value

Test Method

Density / Specific Gravity

1.27 g/cm³

ASTM D792

Moisture Absorption(23 °C;50% RH/24 hrs)

1.0E-02 %

ASTM D570

Mold Shrinkage, Flow(24 hrs)

0.5 %

ASTM D955

Mold Shrinkage, XFlow(24 hrs)

0.5 %

ASTM D955

Melt Flow Rate[MFR](300 °C;1.2 kgf)

12 g/10min

ASTM D1238

Mechanical

Nominal Value

Test Method

Izod Impact, Notched


ASTM D256

23 °C

800 J/m


-30 °C

167 J/m


Izod Impact, Unnotched(-30 °C)

2120 J/m

ASTM D4812

Tensile Stress, Yield(50 mm/min;Type I)

58 MPa

ASTM D638

Tensile Stress, Break(50 mm/min;Type I)

52 MPa

ASTM D638

Tensile Strain, Yield(50 mm/min;Type I)

5.4 %

ASTM D638

Tensile Strain, Break(50 mm/min;Type I)

70 %

ASTM D638

Tensile Modulus(50 mm/min)

2600 MPa

ASTM D638

Flexural Stress, Yield(1.3 mm/min;50 mm;span)

90 MPa

ASTM D790

Flexural Stress, break(1.3 mm/min;50 mm;span)

89 MPa

ASTM D790

Flexural Modulus(1.3 mm/min;50 mm;span)

2400 MPa

ASTM D790

Thermal

Nominal Value

Test Method

UL Recognized(≥ 0.6 mm)

V-0

UL 94

Heat Deflection Temperature[HDT], Unannealed(3.2 mm;1.82 MPa)

114 °C

ASTM D648

CTE, Flow(-40 - 40 °C)

6.2e-05 1/°C

ASTM E831

CTE, XFlow(-40 - 40 °C)

6.7e-05 1/°C

ASTM E831

Relative Temp Index, Elec

80 °C

UL 746B

Relative Temp Index, Mechanical with Impact

80 °C

UL 746B

Relative Temp Index, Mechanical without Impact

80 °C

UL 746B

Electrical

Nominal Value

Test Method

Relative Permittivity(1.0e+9 Hz)

2.92

IEC 60250

Dissipation Factor(1.0e+9 Hz)

7.0E-03

IEC 60250

Processing


Nominal Value

Drying Temperature<Injection>


100 - 110 °C

Drying Time<Injection>


3 - 4 hrs

Drying Time, Cumulative<Injection>


8 hrs

Maximum Moisture Content<Injection>


0.02 %

Melt Temperature<Injection>


275 - 300 °C

Nozzle Temperature<Injection>


275 - 300 °C

Front, Zone 3 Temperature<Injection>


260 - 300 °C

Middle, Zone 2 Temperature<Injection>


255 - 295 °C

Rear, Zone 1 Temperature<Injection>


250 - 290 °C

Hopper Temperature<Injection>


60 - 80 °C

Mold Temperature<Injection>


60 - 90 °C

Back Pressure<Injection>


0.3 - 0.7 MPa

Screw Speed<Injection>


40 - 70 rpm

Shot To Cylinder Size<Injection>


30 - 80 %

Vent Depth<Injection>


0.038 - 0.076 mm





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